At the beginning of September with its, it is more than fresh, by plans with the representatives of Moscow [IT]- journalism shared company AMD.
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At the beginning of September with its, it is more than fresh, by plans with the representatives of Moscow [IT]- journalism shared company AMD.
PS: Quê dos meus outros posts?! n tinham flames mas ok...
http://www.investorshub.com/boards/read_msg.asp?message_id=13272583Haven't heard from Charlie @ The Inq yet, so I'm posting this here at this point.
After the controversy regarding whether or not AMD's first QC part would in fact be the "K8L" as originally meant by Charlie (meaning, double FP + other faster Conroe-like core features), about which Charlie recently wrote that he thought it was NOT to be until late 07 / early 08 http://www.theinquirer.net/default.aspx?article=33906 (and I also believed this was by far the more likely case), I decided, what the heck, why doesn't someone just ask AMD IR the specific question?
So I did.
Dear AMD Investor Relations,
I've read many comments from Henri Richard and others in various articles, discussing the Quad Core part coming in "mid 2007" (sometimes more specifically described as Q2).
I have also seen the features on your Tech Roadmap, and in other presentations, concerning "128-bit FP" and "enhanced IPC core".
My question is simple:
(1) Does the first Quad Core part scheduled for "mid 2007" contain the "128-bit FP" and "enhanced IPC" technology, or will the latter technology be delivered at some other point in 2007, in a different product?
In several interviews, the implied answer seems to be "yes", but I have yet to see it made explicit. Can you clear this up for me?
I expected the usual "we cannot say anything more than you've read already" routine.
So, this morning, I was quite surprised to receive the following reply from AMD IR:
Hi XXXX -
First Quad Core part scheduled for "mid 2007" contain the "128-bit FP"
and "enhanced IPC" technology.
Ruth
Ruth Cotter
Senior Manager, Investor Relations
Advanced Micro Devices (AMD : NYSE)
One AMD Place, P.O. Box 3453, MS 112
Sunnyvale, CA 94088
I wrote back to double-check and was assured that was the correct answer.
Well, that settles that, then. The "mid 2007" QC part *is* the "K8L" as most would use that term.
Some recent reports have placed "mid 2007" as Q2, others as "by August".
Now, if they can just get 65nm fixed...
Head Shot !
Daqui a 6 meses ou a Intel inova ou ... !
Head Shot !
Daqui a 6 meses ou a Intel inova ou ... !
obvio....não ves que a Intel criou o Conroe e dps meteu o pessoal do R&D de férias à espera da AMD
Daqui a pouco mais de 6 meses está aí o intel "Penryn", o "Yorkfield" (8 cores), o "Wolfdale", o "Ridgefield" e o "Perryville", tudo a 45nm.
Todos estes cores devem aparecer antes ou durante os próximos 12 meses, sendo seguidos da nova arquitectura que vai suceder à Core NGMA, a "Nehalem".
A AMD que conheça a nivel de arquitetura que é do que este topico trata tera somente uma que é o K8L. Que virá em 3 versoes conforme o tempo for avançando.
Aposto que todos esses Intel descendem todos de uma unica arquitetura e sao basicamente nomes diferentes para plataformas diferentes.
Isto é sao Core 2 Duo em versoes a 65nm ou 45nm de dual e quad-core. Todos esses nomes nao ditam vitoria nenhuma.
Se o K8L for arquiteturalmente superior a Intel que se cuide como disse o ajax.
Então o K8L também não descende do K8 ?
Se vais pela conversa da descendência, podes dizer que o Core 2 é um Pentium Pro e o K8L é um Athlon "Classic", já que a estrutura básica é a mesma em ambos os casos.
O K8L pouco poderá fazer a não ser que a AMD não demonstre claramente que o processo 65nm S-SOI é maduro o suficiente para competir em preço e performance por alturas do seu lançamento.
K8L and its arc's secrets... The next gen cpu for AM2/AM3 the 1st cpu to support 2 generations of sockets.
K8L has wider closer together threads to enhance its cycles per clock. Will process data much faster then K8 does. Plus the word is they will go upto 4ghz with K8L according to the Inquirer microprocessor news page. The arc on paper can do it so I wouldn't be surprised. You got to understand this is a new arc. K8L and K8's are in a whole different ball leuge!
K8's are still impressive because they are 3 years old and still do this well. Zram is in K8L, the L1 L2 and L3 is 4x smaller in the die shots then K8 L2 but the same size in Kb such as 512kb L2. Sram would take up far too much space to add that much L3 L2 and L1 all on the same die when its smaller then K8 dies.
The manufacturing costs have been reduced because they are going 65nm on the cpu die and 45nm on the zram die. As why its so much smaller and denser. Zram is more proffitable and will improve performance L1 L2 and L3 by 10% as well as the chip. 256-bit Zram with 128-bit wide pipes.
They have 2x the FPU and x1/4th the ALU, with more out of order load buffers and a 4th decoader... this will atleast boost the FPU for SSE by 50% physically because of the extended FPU is 2x the size it was before. And the ALU will be increased from 25% to 50% by spec alone. Physically this makes opervation possible of what it will most likly beable to do.
K8L will be the new SSE monster on the block and will most likly have SSE4a on launch or later on. Atleast we'll get the Ghz wars like we wanted all over again.
the FPU 50% faster. K8L will be clocked much faster as well thanks to 65nm and the enhancments that allow it. Look at the load buffers and decoaders on die shots over the net. This move was made to allow higher clock speeds then previously not possible. K8L has deeper stages as well. Its supose to use Double stress on SOI to allow greater speeds as well as a few other things, I think a new kind of gate in the manufacturing process. Those are really advanced FAB things they are doing... it takes 2 times longer to make these chips then intels because of the complexity of these added processes intel doesn't use.
Silicon Germanium (e-SiGe) with Dual Stress Liner (DSL) and Stress Memorization technology (SMT) on Silicon-On-Insulator (SOI) wafers, will be in K8L and allow these greater clockspeeds or cicles per clock K8's don't use all these processes, only K8L will. I'm not sure witch way AMD will go... the way of conroe in cycles per clock or the P4 as in uping the Ghz.
The new process technologies reduce interconnect delay through the use of lower dielectric constant (lower-K) insulators, which can improve overall product performance and lower power consumption. In addition, the new technologies have shown ability to be manufactured at the 65nm generation and scaleable for use in future generations. So expect some performance jump from 90nm to 65nm as well.
We still don't know how the real product will perform so until then we can only speculate or give oppinions but specs look promising. Soon we will see K8L in the wild so until then. Prob around dec we'll hear of (ES)!