Processador Curiosidades de hardware

[Nemesis11]

Uma apresentação interna e confidencial da Nokia, depois do lançamento do Iphone.

Alguns quotes interessantes vistos a esta distância:

Expect Apple to launch lower-price point models quite soon

Apple declared the end of PC era

No mention either of Java support, unusual user input method may be the reason. Lack of Java would shut out a big mass of existing SW.

• Apple is most probably using the first Application Processor of nVidia in iPhone.
• Made in “custom product mode” for customer
• nVidia acquired PortalPlayer late last year and PortalPlayer has had co-operation with Apple. One factor in nVidia puchasing PortalPlayer was their connection with Apple.

O SoC do primeiro Iphone foi criado e produzido pela Samsung.

• iPhone is not a super feature pack
• iPhone has quad-band GSM-EDGE, WLAN and Bluetooth, but no 3G nor HSDPA
• (only) 2MB camera

Will pure touch input appeal to more mass market consumers?
• Even though Steve Jobs emphasized iPhone superiority to “Buttons”, it is to be expected that the Consumer QWERTY category will continue to succeed.

• There was little mention of security on the iPhone. Perhaps it lacks VPN, secure e-mail.
• No mention of being able to install apps or upgrade the device or even change the battery.

iPhone look copy (i.e. black with silver on the perimeter) version might “steal” some of Apple’s coolness.

• 2008 mkt share target: 1% (10 M units)
• If Apple succeeds in this target at the announced price point, it will create a new high-end market

Foram vendidos 11,6 milhões de Iphones em 2008

The 1% volume share target could translate into 4% value share, taking ~ 30% share of the >300 € price band

Nokia needs to develop touch UI to fight back. S60 should be focus, but Maemo platform can be a critical strength due to openness.

User interface has been a big strength for Nokia, so the UI may be the biggest threat that iPhone presents

Prioritize touch UI development, simplifying basic functionality and PC suite development very high.
• Nokia needs a Chief UI designer.

https://repo.aalto.fi/uncategorized/IO_926740c7-5165-439a-a020-5205aeb4d4d5
Link Alternativo - https://filebin.net/ka15c5ynj8dxcr7b

https://www.aalto.fi/en/nokia-design-archive
https://nokiadesignarchive.aalto.fi/

Nokia Design Archive Texts and Presentations
Nokia Design Archive Pictures
Nokia Design Archive Audiovisual materials

 

[Nemesis11]

As ultimas novidades da CES 1993. Mini Discs, 3D em Videojogos, Filmes interactivos, Óculos VR, Video Phones, PDAs que enviam Faxs, muitas cores berrantes, a Keynote ser dada pela IBM, 1 monitor TFT a cores de 16'' e um tipo que se chama "Dayv".

 

[Nemesis11]

Microsoft Majorana 1

Microsoft unveils Majorana 1, the world’s first quantum processor powered by topological qubits​

All of today’s announcements build on our team’s recent breakthrough: the world’s first topoconductor. This revolutionary class of materials enables us to create topological superconductivity, a new state of matter that previously existed only in theory. The advance stems from Microsoft’s innovations in the design and fabrication of gate-defined devices that combine indium arsenide (a semiconductor) and aluminum (a superconductor). When cooled to near absolute zero and tuned with magnetic fields, these devices form topological superconducting nanowires with Majorana Zero Modes (MZMs) at the wires’ ends.

For nearly a century, these quasiparticles existed only in textbooks. Now, we can create and control them on demand in our topoconductors. MZMs are the building blocks of our qubits, storing quantum information through ‘parity’—whether the wire contains an even or odd number of electrons. In conventional superconductors, electrons bind into Cooper pairs and move without resistance. Any unpaired electron can be detected because its presence requires extra energy. Our topoconductors are different: here, an unpaired electron is shared between a pair of MZMs, making it invisible to the environment. This unique property protects the quantum information.

https://azure.microsoft.com/en-us/b...ntum-processor-powered-by-topological-qubits/

https://arstechnica.com/science/202...ubits-lays-out-roadmap-for-quantum-computing/

 

[blaster_00]

confesso a primeira vez que vi essa imagem do quantum CPU pensei que fosse AI generated

 

[Dark Kaeser]

A ISSCC foi há uns dias, creio que foi apresentado aí.

Também houve uma série de conversas sobre "nodes".

 

[Nemesis11]

confesso a primeira vez que vi essa imagem do quantum CPU pensei que fosse AI generated

A imagem dele foi claramente pensada para um press release e é pouco importante para a notícia em si. Não deixa de ser bonito.
Para quem gostar daquele aspecto "Steam Punk", deixo aqui um vídeo com a criação/construção de um Mini PC, Water Cooled, com um 9800X3D e uma 4090, naquele estilo.

 

[Dark Kaeser]

A opinião do Ian e do George (cheese)

Microsoft recently announced it had created a new type of Quantum Computer, theorized for years. This new topoconductor material is said to behave like a Majorana particle, and can be used to build systems of a million qubits. George and I are not convinced.

 

[Nemesis11]

Texas Instruments MSPM0C1104. World Smallest Microcontroller. 1,38mm²

• Core:
  • Arm 32-bit Cortex-M0+ CPU, frequency up to 24MHz
• Memory:
  • 16KB of flash memory
  • 1KB of SRAM
• High-Performance Analog Peripherals:
  • One ADC with up to 10 external channels
  • ADC resolution: 1.7Msps at 10-bit or 1.5Msps at 12-bit with VDD as the voltage reference
  • Configurable internal ADC voltage reference: 1.4V or 2.5V
  • Integrated temperature sensor
  • Integrated supply monitor
• Intelligent Digital Peripherals:
  • 1-channel DMA controller dedicated for ADC
  • Three timers supporting up to 14 PWM channels
  • One 16-bit advanced timer with deadband support for up to 8 PWM channels
  • One 16-bit general-purpose timer with 4 capture/compare channels
  • One 16-bit general-purpose timer with 2 capture/compare channels
  • Windowed watchdog timer
  • BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square waves
• Flexible I/O Features:
  • Up to 18 GPIOs
  • Two 5V-tolerant open-drain I/Os
• Operating Characteristics:
  • Extended temperature range: –40°C to 125°C
  • Supply voltage range: 1.62V to 3.6V

https://www.ti.com/product/MSPM0C1104

 

[Nemesis11]

Umas coisas da CoolIT

4000W single-phase direct liquid cooling cold plate

Single-phase DLC removes heat from semiconductors using water or a water-glycol mixture running through coldplates mounted directly to chips. This method has become popular for large IT vendors like Dell, Lenovo, HPE, and others who offer high-power AI and HPC systems. In testing, CoolIT’s latest coldplate captured over 97% of heat from a 4000W thermal test vehicle (TTV) at a flow rate of 6 liters per minute (LPM), equivalent to 1.5 LPM per kW—aligning with the semiconductor industry’s recommended flow rate for high-wattage chips.

Thermal resistance is another critical factor in high-performance cooling, and CoolIT’s 4000W coldplate achieves an ultra-low thermal resistance of Tr<0.009 C/W, while keeping the full-loop pressure drop—including fittings and quick disconnects—at just 8 PSI. The company’s Split-Flow technology improves thermal and flow performance by 30% compared to standard coldplates, ensuring targeted cooling for the hottest areas of modern processors.

CoolIT CHx1500 CDU (cooling distribution unit)

1500 kW of cooling capacity at a 5°C approach temperature difference.
The CHx1500’s cooling capacity is supported by a flow rate of 2100 liters per minute (LPM) on the primary side and 1800 LPM on the secondary side, ensuring consistent and efficient heat removal. The unit has two hot-swappable pumps (N+N redundancy) capable of delivering 1500 LPM at a 34 psi pressure drop.

 

[JPgod]

Assusta hoje a quantidade medonha de calor que os datacenters geram e o gasto.

O bom que já existe projetos de usar o calor gerado para "district heating", mas deve ser uma porcentagem bem pequena...
Bonus que era ter estas coisas perto de zonas residenciais o que era bom para empregos mais locais.

 

[Nemesis11]

 

[Dark Kaeser]

https://twitter.com/x/status/1913828899374444879

 

[Nemesis11]

https://twitter.com/x/status/1913828899374444879

Faz lembrar quando a Virginia Tech comprou 1100 Mac Pro G5 + Rede Infiniband e por 5,2 milhões de $ ficou no 3º lugar do Top 500 de Supercomputadores.

Para comparação com o Earth Simulator, o supercomputador mais rápido até Setembro de 2004, apenas uma nVidia B200 (saiu em Março de 2024, 20 anos depois) consegue 62 TFlops FP64 (Tem 2 chips GB100. 31 TFlops FP64 em cada).

 

[Dark Kaeser]

https://twitter.com/x/status/1919743333833822624

 

[Nemesis11]

Se tivessem um controlador de memória DDR4 ainda hoje podiam ser uma boa proposta em Socket AM4, mas percebo porque é que a AMD não se tenha dado ao trabalho de os lançar em Socket AM5, quanto mais em AM4.

Os Ryzen 6000, que só saírem em versão Mobile:

 

[Nemesis11]

Google Project Deschutes CDU (Coolant Distribution Unit)

Inside Google’s Plan to Deliver 1MW Racks and Cool Them Too​

AI’s insatiable appetite for power is no longer theoretical. Google projects that, by 2030, machine learning deployments will demand more than 500 kW per IT rack. This surge is driven by the relentless push for higher rack densities, where every millimeter is packed with tightly interconnected “xPUs” (GPUs, TPUs, CPUs).

At Google, we’ve deployed liquid cooling at GigaWatt scale across more than 2000 TPU Pods in the past seven years with remarkable uptime — consistently at about 99.999%. Google first used liquid cooling in TPU v3 that was deployed in 2018. Liquid-cooled ML servers have nearly half the geometrical volume of their air-cooled counterparts because they replace bulky heatsinks with compact cold plates. This allowed us to double chip density and quadruple the size of our liquid-cooled TPU v3 supercomputer compared to the air-cooled TPU v2 generation.

We’ve continued to refine this technology generation over generation, from TPU v3 and TPU v4, through TPU v5, and most recently, Ironwood. Our implementation utilizes in-row coolant distribution units (CDUs) with redundant components and uninterruptible power supplies (UPS) for high availability. These CDUs isolate the rack's liquid loop from the facility loop, providing a controlled, high-performance cooling system delivered via manifolds, flexible hoses, and cold plates that are directly attached to the high-power chips. In our CDU architecture, named Project Deschutes, the pump and heat exchanger unit is redundant, which is what has enabled us to consistently achieve the above-mentioned fleet-wide CDU availability of ~99.999% since 2020.

https://cloud.google.com/blog/topic...t-racks-and-liquid-cooling-at-ocp-emea-summit

Não sei se estão a pensar fazer uma versão para uso doméstico.

 

[kerouac]

Agora pensem: 180.000$00 eram 900 euros em 1995...