DFI Lanparty UT P35-TR? pics

Crazy Inside

Crazy Inside

Folding Member
elmor disse:
Kevin told me to post these ;)

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Enjoy! Sorry, don't know if it's T2R or T3R, but I belive there will be both versions ;)


http://www.ocxtreme.org/forumenus/showthread.php?p=14898#post14898
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Abraço
 
Esta board verde fez lembrar a lendária DF NF2-ULTRA-B :D

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Mas este heatpipe monstruoso mete medo, fdzz. Será que a board FERVE assim tanto?

Tirando este apêndice monstruoso, que felizmente é modulável/opcional, o cooling parece jeitoso ;)

Mas com tal cooling, não deve ser NADA barata!
 
destr0yer disse:
Tirando este apêndice monstruoso, que felizmente é modulável/opcional, o cooling parece jeitoso ;)

Mas com tal cooling, não deve ser NADA barata!
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100% de acordo...andava a pensar nessa board mas assim....8| ...será k vai pra gama >300€? Se sim...nem imagino qual será o preço da prima com X38 :007:
 
ToTTenTranz disse:
O cooler anula logo à partida uma das portas PCI ou PCI-Express. Isso não é um bocado.. mal desenhado?
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a minha principal duvida, esta relacionada com a real necessidade de tanto aparato, para sair um heat pipe do south bridge, que vai levar calor àquele radiador...

se a boar estiver de pernas para o ar, a coisa se calhar ainda funciona, agora se o radiador for o ponto mais baixo, dificilmente estará ali a fazer alguma coisa de jeito.

quanto à slot PCI ocupada, posso estar errado, mas creio que é possivel por o radiador em diversas possições, uma delas, é imediatamente acima da placa grafia... mas enquanto o ponto de contacto for em cima do south bridge, não vejo grandes vantagens, visto que o interessante seria retirar calor do north bridge.

enfim, quer-me parecer que se trata de mais marketing do heat pipe.

e a blitz parece-me uma board potencialmente mais interessante.
 
Parece-me... Que aquele cooler (heatpipes) no SB tem como objectivo único OC extremos, nomeadamente para sessões de benchs em que o sistema se encontra em cima de uma mesa e não dentro de uma caixa.

Caso assim seja... Então não há nada a recear, pois sem os heatpipes no SB deverá certamente possibilitar OC elevados condizentes com o fabricante DFI. Para sessões de OC extremos que são realizadas fora de qualquer caixa de pc, então sim aquele cooler deverá fazer todo sentido.

Para quem não tem acompanhado as ultimas boards da DFI, então creio ser importante informar que a DFI agora parece ter optado por uma nova estratégia mais condizente com os seus clientes mais exigentes, dado que fornece as boards high-end com os respectivos coolers do chipsets em separado e não montados na board. Esta board ao que tudo idêntica torna mais evidente a intenção e objectivo do fabricante.
 
Isso foi o caso da 680i LT, devido ao tamanho do cooler e não caber na caixa, esta já deve vir integrado, com o "apêndice" em separado.

este radiador pode ser útil em caixas com ATX invertido também...
 
Koncaman disse:
a minha principal duvida, esta relacionada com a real necessidade de tanto aparato, para sair um heat pipe do south bridge, que vai levar calor àquele radiador...

se a boar estiver de pernas para o ar, a coisa se calhar ainda funciona, agora se o radiador for o ponto mais baixo, dificilmente estará ali a fazer alguma coisa de jeito.

quanto à slot PCI ocupada, posso estar errado, mas creio que é possivel por o radiador em diversas possições, uma delas, é imediatamente acima da placa grafia... mas enquanto o ponto de contacto for em cima do south bridge, não vejo grandes vantagens, visto que o interessante seria retirar calor do north bridge.
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tambem me pareceu isso, mas após olhar para a furação (quatro furos) que os dissipadores do pwm têm, parece que o "apendice" tanto pode ser acoplado a um como a outro, tornandoa board eficiente quer em atx quer em atx invertido. ainda assim, sao suposiçoes.
 
ja saiu



DFI Launches LANParty UT P35 Motherboard


DFI introduced yesterday the latest addition to its LANParty extreme motherboard line, the LANParty UT P35-T3R. The board adopts P35 + ICH9R chipsets as north and south bridge. Further, P35 supports DDR3 memory and Intel's next generation 45nm process CPUs. Known for innovation, DFI is also introducing with this motherboard, a whole new idea of external chipset cooling assembly.


[---]

The secret weapon: DFI unique heat pipe assembly

arch460b.jpg


The designer of DFI LP UT P35 series has created a whole new “weapon”, a heat pipe assembly from SB, NB then extend to PWM. The design of DFI's new heat pipe is totally different to others in market.

It uses a copper-made pipe to connect independent heat sinks of SB, NB and PWM together. Then, there will be an extension joint (Transpiper) to carry the heat out from the chassis. The Transpiper can be extended to where outside the PSU fan. That means the air flow from the PSU fan will be help to carry out the heat from Transpiper. Otherwise, the heat air flow will be stuck inside the chassis and that will jeopardize the stability of the system. This is a magnificent breakthrough of heat pipe assembly design.

Unique arrangement for Crossfire + Physics rendering
Since the Physics rendering technology has been revealed in PC market, gamers are all to pay close attention to it. Meanwhile, DFI was put it into LANParty motherboard as an advance features and that shows the gigantic power of Crossfire + Physics rendering. But 3 VGA cards bring a lot of heat as the same time. Hence, the arrangement of 3 VGA slots (2 CF + 1Physcis) seems especially essential for the system. If the spaces between 3 VGA slots are not enough, that'll cause heat dissipation problems. Therefore, DFI propose a perfect solution for that; the designer separated each of the slots with 2 additional PCI slot space. That means the 3 VGA slots located evenly in the board. That's a big improvement for efficient heat dissipation of VGA area between those “thick cards”(ex.1900, 2900).

Ultimate 8-phase Digital PWM
DFI is never satisfied to use any components of inferior quality. For this brand new model LP UT P35-T2R, DFI chooses to use an utmost 8 -phase Digital PWM in place of the advance 6-phase PWM. A digital PWM uses components to supply stabilized current, which accommodate enthusiasts ' needs in OC or Gaming. DFI UT P35 series provides sufficient current for the processor. Aside from this, the new heat dissipating fins of the PWM circuit further stabilize current flow to the system.
The cutting-edge audio solution- “Bernstein Audio”

Leonard Bernstein, best-known conductor and music composer of USA i n 50's of 20 century. Bernstein represents the supreme authority of classical music in Northern America. LP UT P35 series is equipped with this brand new “Bernstein Audio” module. In fact, the board's designer uses a new way to generate this module. For easier installation, designer moved this module close to “PCI slots area” for easy to mount in PCI bracket. Second, it obtains a perfect noise reduction than Karajan's. As all we know, no matter Pro-gamers or power users who used to enjoy music and movie with their PCs must have highly requests about the quality of their audio output device. Hence, how much the noise can be reduced is what they concerned about in high priority. DFI's Bernstein audio module is intents to improve this kind of issue; it uses a unique way to separate the “signal” of audio module and motherboard, which makes the electric interfere of audio output decrease to minimum level.

Bernstein audio adopts Realtek ALC885 high definition codec. It is certified by Microsoft Vista Premium. In addition, ALC885 features a DAC SNR of 106dB and ADC SNR of 101dB. Then, the codec also supports sampling at highest 192 KHz, 10 DAC channels, 3 Stereo ADC channels (7.1 + 2 channels) and 24bit PCM. Besides, it provides “Full-rate Lossless Content Protection Codec”, which's able to decrypt Content Protection for HD-DVD in the future, if not; the sound quality of DVD will be a step lower than the standard.

Supports DDR2/ DDR3 memory
The substitution of memory's each generation is being faster and faster. We still remember that; the market leads us to replace our memory to DDR2 while we're just used to use DDR. Then, we're finally figure out what exactly DDR2 is, meanwhile, the module manufacturer teaches us to choice DDR3 and try to say goodbye to DDR2. Hence, DFI is considerate of power users' unique demand. LP UT P35 series is ready to launch DDR2 and DDR3 models to satisfy power users' request. The LP UT P35 T3R (DDR3) will be launch into market right after LP UT P35 T2R.

Versatility BIOS options
Enthusiasts are always found great pleasure when they are able to squeeze a little more performance from their system through overclocking. For this reason, the designer of DFI LP UT P35-T2R offers a versatility BIOS options for enthusiasts to enjoy during they overclocking. So, the voltage options are the key point, which includes: memory voltage options, NB & SB options, CPU Vcore option and HT voltage options. That would make enthusiasts an unlimited OC environment. Besides, the unique CMOS Reload can help users to store different OC settings in BIOS. Further, LANParty series motherboard adopts high quality capacitors and components for an advance OC “physical structure”.

Teaming function & Dual Gigabit LAN
At the very beginning, LANParty series provides Dual gigabit LAN to gamers as a basic feature. Nowadays, it is almost a “must” when users want to grab information such like DVD content, huge capacity games or fighting with buddies on LAN game. For that reason, DFI LP UT P35-T2R provides another unique function to all the heavy user of Internet/ LAN - the Teaming function. It makes the dual LAN Ports' bandwidth to combine together as one. Then the bandwidth will be two times large than original one. Moreover, if one of the LAN port crashed, the other one will be carry on the processing task over Internet or LAN. Therefore, teaming function is brings you a wider and safer LAN transmission environment.

Source: DFI
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The developing speed of PC industry is incredible fast in these years. It just likes: CPU transformation, which is transit from dual core to quad core, the FSB from 800/ 1066MHz up to 1333HMz. On the other hand, VGA just started the competition between SLI & Crossfire, and then additional physics rendering function involves the war…Also, the generation of memory is from DDR and all the way down to DDR3 era. All these changes have happened within 2 years; likewise, DFI also has transformed a lot in product design. The first revolution is to replace traditional mosfit with digital PWM. And then, “EZ clear” for users to clear CMOS in a easier way. Further, DFI tried to use a separate advance audio device (Karajan audio and Bernstein) in LANParty motherboard. Now, DFI are intended to gathering those advance features together in a brand new model, the LANParty UT P35-T2R.

CPU, FSB and chipset's structure

DFI LP UT P35-T2R/T3R supports Intel's dual and quad core processors. It is compatible with FSB 1333MHz. The benefit of the low power consumption from core 2 dual series makes a better operate environment . The highest FSB1333MHz increase the probability to get a highest OC record. The board adopts P35 + ICH9R chipsets as North and south bridge. Further, P35 supports DDR3 memory and Intel's next generation 45nm process CPU. That is a powerful upgrade for Intel platform. In addition, the chipset also supports latest Matrix Storage technology and HAD audio technology, which maximized the storage and audio output ability.

The secret weapon: DFI unique heat pipe assembly

The designer of DFI LP UT P35 series has created a whole new “weapon”, a heat pipe assembly from SB, NB then extend to PWM. The design of DFI's new heat pipe is totally different to others in market.

It uses a copper-made pipe to connect independent heat sinks of SB, NB and PWM together. Then, there will be an extension joint (Transpiper) to carry the heat out from the chassis. The Transpiper can be extended to where outside the PSU fan. That means the air flow from the PSU fan will be help to carry out the heat from Transpiper. Otherwise, the heat air flow will be stuck inside the chassis and that will jeopardize the stability of the system. This is a magnificent breakthrough of heat pipe assembly design.

The cutting-edge audio solution- “Bernstein Audio”
arch460d.jpg

Leonard Bernstein, best-known conductor and music composer of USA i n 50's of 20 century. Bernstein represents the supreme authority of classical music in Northern America. LP UT P35 series is equipped with this brand new “Bernstein Audio” module. In fact, the board's designer uses a new way to generate this module. For easier installation, designer moved this module close to “PCI slots area” for easy to mount in PCI bracket. Second, it obtains a perfect noise reduction than Karajan's. As all we know, no matter Pro-gamers or power users who used to enjoy music and movie with their PCs must have highly requests about the quality of their audio output device. Hence, how much the noise can be reduced is what they concerned about in high priority. DFI's Bernstein audio module is intents to improve this kind of issue; it uses a unique way to separate the “signal” of audio module and motherboard, which makes the electric interfere of audio output decrease to minimum level.

Bernstein audio adopts Realtek ALC885 high definition codec. It is certified by Microsoft Vista Premium. In addition, ALC885 features a DAC SNR of 106dB and ADC SNR of 101dB. Then, the codec also supports sampling at highest 192 KHz, 10 DAC channels, 3 Stereo ADC channels (7.1 + 2 channels) and 24bit PCM. Besides, it provides “Full-rate Lossless Content Protection Codec”, which's able to decrypt Content Protection for HD-DVD in the future, if not; the sound quality of DVD will be a step lower than the standard.
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Q6600 + DFI P35 ?? :D :D


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