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Processador Intel Completes Next Generation, 32nm Process Development Phase

Discussão em 'Novidades Hardware PC' iniciada por PsySc0rpi0n, 12 de Dezembro de 2008. (Respostas: 8; Visualizações: 2050)

  1. PsySc0rpi0n

    PsySc0rpi0n Power Member

    Intel Corporation has completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32 nanometers (a billionth of a meter). The company is on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009. Intel will provide a multitude of technical details around the 32nm process technology along with several other topics during presentations at the International Electron Devices meeting (IEDM) next week in San Francisco.


    Finishing the development phase for the company's 32nm process technology and production readiness in this timeframe means that Intel remains on pace with its ambitious product and manufacturing cadence referred to as the company's "tick-tock" strategy.

    That plan revolves around introducing an entirely new processor microarchitecture alternating with a cutting edge manufacturing process about every 12 months, an effort unmatched in the industry. Producing 32nm chips next year would mark the fourth consecutive year Intel has met its goal.

    The Intel 32nm paper and presentation describe a logic technology that incorporates second-generation high-k + metal gate technology, 193nm immersion lithography for critical patterning layers and enhanced transistor strain techniques. These features enhance the performance and energy efficiency of Intel processors. Intel's manufacturing process has the highest transistor performance and the highest transistor density of any reported 32nm technology in the industry.

    "Our manufacturing prowess and resulting products have helped us widen our lead in computing performance and battery life for Intel-based laptops, servers and desktops," said Mark Bohr, Intel Senior Fellow and director of process architecture and integration. "As we've shown this year, the manufacturing strategy and execution have also given us the ability to create entirely new product lines for MIDs, CE equipment, embedded computers and netbooks."

    Other Intel IEDM papers will describe a low power system on chip version of Intel's 45nm process, transistors based on compound semiconductors, substrate engineering to improve performance of 45nm transistors, integrating chemical mechanical polish for the 45nm node and beyond; and, integrating an array of silicon photonics modulators. Intel will also participate in a short course on 22nm CMOS Technology.

    Source: Intel
     
  2. SonicMayhem

    SonicMayhem Suspenso

    Sweet!

    daqui a seis anos as arquitecturas ja tao nos 22nm e os gpus ja sao quad cores :D

    a evolucao da tecnologia informatica nunca deixa de surpreender :D
     
  3. gcseco

    gcseco [email protected] Member

    eu acho mas é que qualquer dia temos que descer de escala (nm) para outra ainda mais pequena visto as arquitecturas o serem cada vez mais
     
  4. JPgod

    JPgod Moderador
    Staff Member

    Antes disso aparece um novo material... Não creio que consiga-se passar dos 10 nm com silício.
     
  5. enok

    enok [email protected] Member

    queres dizer, descer para o picometro?? nãao me parece... isso acarreta uma série de problemas extremamente difíceis de resolver, tendo em conta os materiais actuais. (como o destr0yer disse)

    se algum dia encontrarem um material que permita isso... os computadores quânticos ficam ali ao virar da esquina... :freak3:
     
  6. TheX

    TheX Power Member

    Passar abaixo do nanómetro estamos a falar de dimensões do tamanho dos átomos e ai as coisas já são mais complicadas.

    Penso que nessas dimensões já a mecânica quântica entrou em acção. :)
     
  7. jcpbs

    jcpbs Power Member


    Era isso que ia escrever. Há uns anos (talvez 5 anos) a IBM já estava a tentar fazer uns processadores "quanticos", lol, para consumo doméstico. Não sei como é que isso hoje em dia anda...
     
  8. PitFire

    PitFire I'm cool cuz I Fold

    tambem li por ai que existe a possibledade de substituir o silicio por nano tubos de carbono com um caracteristica qualquer para a induçao de cargas eletricas
     
  9. AquaDementio

    AquaDementio Power Member

    Eu vi um artigo num lado qualquer que dizia que o suposto problema de moore, basicamente condutores de silicio inferiores a 20nm sofreriam de vários tipos de problemas, tinha sido resolvido, o silício vai ter de ser usado em combinação com o germanio para podermos fabricar a uma escala inferior a 20nm. vou tentar arranjar o link...

    Encontrei, vejam http://www.physorg.com/news148054154.html
     

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