Processador Intel CPU 2018-2021 Roadmap Leaks Out

Quase 15 MB de SRAM (tirando a L1+L2) por Core? 8|


Parece que, em próximas gerações, a Intel irá separar a L3 do Core, além do IO, para permitir flexibilidade e usar diferentes processos de fabrico.
On the packaging side, for Clearwater Forest, Intel says that it is going to use other process nodes for SRAM and I/O that do not scale as well on newer processes. AMD has its IO Die introduced with the EPYC 7002 series “Rome” on a different process for I/O. AMD also has 3D V-Cache we first reviewed with Milan-X and then Genoa-X. Our guess is that AMD is going to have to introduce a similar cache technology for future cloud-native CPU versions because everyone in the industry is running into the reality that SRAM is not scaling. Intel’s version, however, appears to put dies with cores atop cache dies.

Este Clearwater Forest, terá algumas novidades. A nível de packaging:
euYYKor.jpeg

Intel is planning to use Foveros Direct 3D which involves direct die-to-die copper bonding between top tiles and base dies. When we look at the pictures of Clearwater Forest above, we can see the compute dies on what are likely SRAM and fabric base dies.

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Another packaging technology coming on Clearwater Forest is Intel EMIB 3.5D. Here, Intel is combining several of its technologies like its EMIB (chip-to-chip bridge) and Foveros Direct 3D is called EMIB 3.5D.

A nível do processo de fabrico:
H1b8pPm.jpeg

RibbonFET has the transistor gate wrapped around the channel, and these can also be made in different widths. The result is a more efficient transistor.

FS57A11.jpeg

The second big technology is the PowerVIA. Intel is delivering backside power which we heard multiple folks at the Foundry event this week say they expect about 6% improvements just from that alone.

Render do Clearwater Forest:
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Clearwater Forest is currently set to be the leading Intel 18A Xeon processor incorporating that node’s set of technologies as well as advanced packaging. Another way of saying it, we expect more cores with more performance and better power efficiency.
https://www.servethehome.com/intel-clearwater-forest-is-set-to-be-a-tech-breakthrough-server-chip/

Este 18A penso que deverá ser equivalente aos 2 nm TSMC.
 
Já se mudava o nome do tópico para 'Intel cpu Leaks -roadmap' e tirava-se o 2018-2021?!

:o
:n1qshok:

Apresentação dos resultados do Q4 2023



Screenshot-2024-01-26-at-21-21-42-Power-Point-Presentation-Q4-2023-Earnings-Deck-pdf.png

Com o hardware dedicado a IA a gerar dinheiro como nunca e valorização de empresas (NVIDIA e a bolha TSLA) a dispar por conta do hype, a Intel é bem capaz de se a única empresa capaz de ter o ramo de AI a perder dinheiro..
 
Bom a Intel agora resolveu alterar a forma como reporta as contas de 2023 (e 2022/2021 aparentemente), retirando a IFS da equação, e colocar esta a arcar com os "prejuízos"... OM de -37%

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o que teve como consequência óbvia aumentar as margens dos seus produtos.

Ou seja a Intel basicamente resolveu fazer uma "operação contabilística", em que se assume e reporta como se de uma empresa de "chips fabless" se tratasse, tal como Qualcom, AMD ou NVidia, que se limitam a desenvolver chips, entregando o fabrico a um terceiro, a TSMC, e depois a venderem os ditos chips.






Claro que isto não foi feito de forma inocente:


Intel shares fall after company reveals $7 billion operating loss in foundry business​

Intel shares fell 4% at one point in extended trading on Tuesday after the company revealed long-awaited financials for its semiconductor manufacturing business, commonly called the foundry business, in a SEC filing.
Intel said its foundry business recorded an operating loss of $7 billion in 2023 on sales of $18.9 billion. That’s a wider loss than the $5.2 billion Intel reported in its foundry business in 2022 on $27.5 billion in sales.

This is the first time that Intel has disclosed revenue totals for its foundry business alone. Historically, Intel has both designed its own chips as well as done its own manufacturing, and reported final chip sales to investors.
Intel has been pitching investors under CEO Patrick Gelsinger on a plan where it would continue to make its own processors, but would also start an external foundry business to make chips for other companies. Intel’s role as one of the only U.S. companies doing cutting-edge semiconductor manufacturing on American soil was a big reason why it secured nearly $20 billion in CHIPS and Science Act funding last month.
Much of Intel’s foundry revenue currently comes from its own operations, the chipmaker said on Tuesday. Intel also restated its products divisions to report its costs as if it were a so-called “fabless” company that has to account for foundry as a cost.
Intel said on Tuesday that it expected its foundry’s losses to peak in 2024 and eventually break-even “midway” between this quarter and the end of 2030.
https://www.cnbc.com/2024/04/02/int...llion-operating-loss-in-foundry-business.html
 
Contabilisticamente a opção é boa, à partida.

No funco é uma espécie de "Chique espertice", pois com esta iniciativa escondem "a parte feia" da realidade total da operação. O problema (deles) é que os acionistas não são parvos, daí a queda em bolsa já em vigor, e que poderá ser ainda maior.
 
400-500W?

Ainda não consegui compreender como é que eles vão ser competitivos contra os Epyc Zen4c, tanto na versão 144 como 288 Cores, que ainda por cima já saíram há bastante tempo.
É que um Zen4c tendo uma área bem mais pequena que um "Big Core" (Zen4), não tem o hit de performance de um "Little Core".
 
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