Nemesis11
Power Member
Leak das specs do Meteor Lake Mobile:
3 níveis de Big Little. P Cores + E Cores + LP E Cores.
Intel 4 no CPU Tile, 3 nm TSMC no GPU Tile, 6 nm TSMC no SOC Tile.
24 MB L3.
128 EUs na gráfica.
VPU, Wireless e 4 portas Thunderbolt no SOC.
LPDDR 7400 e DDR5 5600 (Não percebo o limite de 96 GB de RAM, com 1 DPC, se for dual channel)
Pci-Ex Gen 5.


Intel combines a CPU and GPU tile, which, according to the rumors, will be manufactured by TSMC in 3 nm. Keyword yield rate: a defective graphics unit (iGP) is thus ruled out in the future and you are much more flexible in the combination of CPU and GPU. However, all this is not new, but the following block diagram is. It also reveals further interesting details about the U, P and H models, which can thus probably be regarded as confirmed.
We can see the renewed division with P, E and LP E-cores on the diagram, whereby Intel writes of a 7 nm CPU here. However, this probably refers to the Intel 4 EUV process, while Intel’s Xe LPG graphics should be manufactured in TSMC’s 3 nm. Previously, the talk was mostly of Xe HPE, now the slide calls for LPG. It is also interesting that Intel only writes about PCIe Gen 5 port for the dedicated graphics in the H models, while the U and P models probably rely on Gen 4 at most. Up to 14 cores will be possible in the P and H versions (6x P and 8x E cores), whereas the frugal U version will have a maximum of 12 cores. It is also worth noting that Intel divides the E-cores into E- and LP (low power) cores, which internally amounts to a three-way split.
The iGP can have up to 128 Execution Units (EU), which is quite a lot, but probably needed to keep up with the Ryzen 7000 family. The memory configuration, which has to do without DDR4/LPDDR4(X) completely, turns out quite lush with up to 96 GB DDR5 5600 or up to 64 GB LPDDR5(X) 7467.
https://www.igorslab.de/en/intel-me...e-block-diagram-of-mobile-14-generation-leak/As already written, the chart refers to the mobile variants, while the slides for Meteor Lake S as the desktop variant have not been distributed yet. We’ll have to be patient here, if we use Alder Lake as a yardstick. So, as always, it remains exciting, because in theory it all reads quite tasty. Let’s just hope that Intel is closer to schedule this time and doesn’t delay much more.
3 níveis de Big Little. P Cores + E Cores + LP E Cores.
Intel 4 no CPU Tile, 3 nm TSMC no GPU Tile, 6 nm TSMC no SOC Tile.
24 MB L3.
128 EUs na gráfica.
VPU, Wireless e 4 portas Thunderbolt no SOC.
LPDDR 7400 e DDR5 5600 (Não percebo o limite de 96 GB de RAM, com 1 DPC, se for dual channel)
Pci-Ex Gen 5.
Última edição: