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OCZ Hints at Radical Approach to Heatsink Design

Discussão em 'Modding e Overclock' iniciada por PsySc0rpi0n, 12 de Janeiro de 2007. (Respostas: 5; Visualizações: 761)

  1. PsySc0rpi0n

    PsySc0rpi0n Power Member

    OCZ Hints at Radical Approach to Heatsink Design


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    Heatpipes to make an appearance in memory design this year

    OCZ Technology today announced its newest memory designs behind closed doors. The design, currently codenamed Flexpipe, will make an appearance on high-end OCZ XTC as early as February 2007.

    The design of the Flexpipe heatsink revolves around a heatpipe that transfers heat from the module to another heatsink one centimeter above the memory bank. Air can pass freely under and over the heatsink bank -- an approach that allows air to move over the heatsinks of multiple modules when installed on a motherboard.

    The new memory design just finished its pre-production trials and the company will move into test trial phases this month.

    OCZ recently announced its hybrid FlexXLC heatsink, a design that can work as a watercooled or aircooled sink. OCZ Technology Vice President of Marketing and Communications, Alex Mei, claims "the Flexpipe is mainly designed for a memory platform above the OCZ XTC series memory, but will be priced more aggressively than FlexXLC modules."

    Most likely, Flexpipe devices will go head-to-head against Corsair's wildly popular DOMINATOR series memory introduced in mid-2006.




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  2. S1nnless

    S1nnless What is folding?

    Onde é que isso acaba?
     
  3. Taz

    Taz To fold or to FOLD?

    E isto é necessário por que...? :zzz:
     
  4. PsySc0rpi0n

    PsySc0rpi0n Power Member

    Quanto mais rápidas são as mems mais calor tendem a dissipar... Daí que cada vez mais a procura de soluções de refrigeramento esteja nas prioridades dos fabricantes...
     
  5. Goncalo Silva

    Goncalo Silva Power Member

    Oh my God... que exagero... ter uns dissipadorezitos à volta da RAM ainda lá vai. Mas isso em cima? lol
     
  6. VoRtAn_MaDgE

    VoRtAn_MaDgE A.S.Team performed

    Como não tenho caixa pó pc, já n tenho desculpa para não ir a lan's...levo o sistema todo já ligado á board e as mem's fazem d pega :x2: ...

    A ideia do heatpipe é interessante nas mem's... ele teria d ir para algum lado, ali é onde estorva menos mesmo assim.
     

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