Processador TSMC to Kick off Mass Production of Intel CPUs in 2H21

Nemesis11

Power Member
Estive indeciso se deveria criar uma nova thread ou não, mas dada a dimensão da possível noticia, da origem do press release e da Intel ir ter o anuncio de resultados dentro de alguns dias (28 Janeiro), decidi arriscar. A ser verdade, merece uma thread à parte. Se não for........oops :D

Aqui fica:
TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce

Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations. While the company is planning to kick off mass production of Core i3 CPUs at TSMC’s 5nm node in 2H21, Intel’s mid-range and high-end CPUs are projected to enter mass production using TSMC’s 3nm node in 2H22.

In recent years, Intel has experienced some setbacks in the development of 10nm and 7nm processes, which in turn greatly hindered its competitiveness in the market. With regards to smartphone processors, most of which are based on the ARM architecture, Apple and HiSilicon have been able to announce the most advanced mobile AP-SoC ahead of their competitors, thanks to TSMC’s technical breakthroughs in process technology.

With regards to CPUs, AMD, which is also outsourcing its CPU production to TSMC, is progressively threatening Intel’s PC CPU market share. Furthermore, Intel lost CPU orders for the MacBook and Mac Mini, since both of these products are now equipped with Apple Silicon M1 processors, which were announced by Apple last year and manufactured by TSMC. The aforementioned shifts in the smartphone and PC CPU markets led Intel to announce its intention to outsource CPU manufacturing in 2H20.

TrendForce believes that increased outsourcing of its product lines will allow Intel to not only continue its existence as a major IDM, but also maintain in-house production lines for chips with high margins, while more effectively spending CAPEX on advanced R&D. In addition, TSMC offers a diverse range of solutions that Intel can use during product development (e.g., chiplets, CoWoS, InFO, and SoIC). All in all, Intel will be more flexible in its planning and have access to various value-added opportunities by employing TSMC’s production lines. At the same time, Intel now has a chance to be on the same level as AMD with respect to manufacturing CPUs with advanced process technologies.

http://www.trendforce.com/presscenter/news/20210113-10651.html

A ser verdade, isto levanta uma série de questões, tanto a nível do roadmap da Intel, como a nível da parte de fabricação de chips que a Intel tem, como também de capacidade a nível de quantidades, por parte da TSMC.
 
Já não sei em que podcast escutei mas alguém argumentava que a Intel é uma empresa que produz chips e que os desenha também (por esta ordem). As fabs da Intel são muito muito importantes para empresa porque para além de consumirem muitos recursos dão garantia de capacidade instalada.

A Intel produz tantos mas tantos chips que para fazer sentido fazer outsource teria de ter investido em parceria com a TSMC (no caso) já há algum tempo de forma a ser racional também para a TSMC. A TSMC não vai investir em capacidade há toa (está já no limite e nem consegue suprimir as necessidades dos clientes actuais) para abastecer uma concorrente sabendo que a mesma tem as próprias fabs e que mal consiga corrigir os problemas que tem tido voltará a produzir tudo internamente. Muito menos deixará outros clientes para trás, clientes esses que não tendo fabs nunca os vão deixar na mão.


Acho isto pouco credível dos dois pontos de vista.
 
Acho que faz todo o sentido (até muito) se for um investimento conjunto. Risco nulo para ambos, aumento de negócio, provável partilha de "know-how".
 
A TSMC vai ter uma nova fabrica 5/3nm, mas acho que não está assim tao breve era para ser inaugurada em 2022 acho ? . Agora parece-me viavel até, mas seria algo lógico do genero a intel fazer outsourcing para CPU's de mais baixo consumo para dispositivos moveis.
Mantendo o resto da fabricas próprias para Xeon/servidores e desktop visto que os equipamentos devem estar optimizados para os 10nm? (especulação :p ou nao)

Cps
 
Duas noticias sobre o assunto. Uma da Bloomberg, que até já é de dia 8 de Janeiro e uma de um jornal do Oregon.

Intel Talks With TSMC, Samsung to Outsource Some Chip Production

TSMC readies new facility that can serve Intel’s needs
Intel holds out hope for late gains by in-house manufacturing

Intel Corp. has talked with Taiwan Semiconductor Manufacturing Co. and Samsung Electronics Co. about the Asian companies making some of its best chips, but the Silicon Valley pioneer is still holding out hope for last-minute improvements in its own production capabilities.

After successive delays in its chip fabrication processes, Santa Clara, California-based Intel has yet to make a final decision less than two weeks ahead of a scheduled announcement of its plans, according to people familiar with the deliberations. Any components that Intel might source from Taiwan wouldn’t come to market until 2023 at the earliest and would be based on established manufacturing processes already in use by other TSMC customers, said the people, asking not to be identified because the plans are private.

Talks with Samsung, whose foundry capabilities trail TSMC’s, are at a more preliminary stage, the people said. TSMC and Samsung representatives declined to comment. An Intel spokesperson referred to previous comments by Bob Swan, the company’s chief executive officer. Intel shares reversed some losses from earlier on Friday, leaving the stock down 0.5% in afternoon trading in New York.

Swan has promised investors he’ll set out his plans for outsourcing and get Intel’s production technology back on track when the company reports earnings Jan. 21. The world’s best-known chipmaker has historically led the industry in advanced manufacturing techniques, essential for maintaining the pace of performance increases in modern semiconductors. But the company has suffered years-long delays that have put it behind competitors that design their own chips and contract TSMC to do the manufacturing.

Under the leadership of Jim Keller, Intel designers moved to a more modular approach to creating microprocessors. This provides more flexibility to either make chips in-house or outsource the work. But Keller left Intel last year, and rivals, such as Advanced Micro Devices Inc. and Apple Inc., have forged ahead with their own capable designs and TSMC’s more advanced production technology. That has put Intel under intense competitive pressure and forced it to make last-minute changes to product road maps, complicating its decision making, the people said.

“We have another great lineup of products in 2022, and I’m increasingly confident in the leadership our 2023 products will deliver on either Intel 7-nanometer or external foundry processes, or a combination of both,” Swan said on a conference call in October. Semiconductor manufacturing processes are measured in nanometers, with ever more microscopically small transistors crammed onto silicon wafers with each new iteration.

At subsequent investor conferences, Swan explained that the timing of his decision is driven by the need to order chipmaking equipment to make sure he has enough factory capacity or give a partner enough of a heads-up to make similar preparations. Being able to predictably deliver leading products to customers on time, at the right cost, will determine how much outsourcing Intel uses, he said.

TSMC, the largest maker of semiconductors for other companies, is preparing to offer Intel chips manufactured using a 4-nanometer process, with initial testing using an older 5-nanometer process, according to the people. The company has said it will make test production of 4-nanometer chips available in the fourth quarter of 2021 and volume shipments the following year.

The Taiwanese company expects to have a new facility in Baoshan operational by the end of this year, which can be converted to production for Intel if required, one of the people said. TSMC executives previously said the new Baoshan unit would house a research center with 8,000 engineers.

Activist investor Dan Loeb has also given voice to shareholder discontent with what’s perceived to be Intel’s technological stagnation, urging that the company make aggressive strategic changes.

While Intel has outsourced production of lower-end chips before, it has kept the manufacturing of its best semiconductors in-house, considering it a competitive strength. Its engineers have historically tailored their designs to the company’s manufacturing processes, making a shift to outsourcing of flagship products unthinkable in the past.

As the provider of 80% of personal computer and server processors globally, Intel produces hundreds of millions of chips each year. That scale dictates that any potential supplier must create new capacity to accommodate Intel.

In July, the company said its 7-nanometer production would arrive a year later than previously planned. That followed a three-year delay in the introduction of the preceding 10-nanometer generation, which is only reaching mainstream use now. Those holdups have allowed TSMC and Samsung to lay claim to better technology for the first time, with TSMC already producing 5-nanometer silicon at volume for Apple and others. That timeline suggests other customers could move to better TSMC production before Intel would.

Intel’s strategic shifts are happening at a time of booming demand as well as technological change in the chip industry. The traditional method of improving performance by shrinking and cramming more transistors into each package is being supplanted by more sophisticated techniques that include stacking processor and memory components into single chips and the introduction of more tailored designs for tasks like artificial intelligence.

AMD and others have partially mitigated the risk of manufacturing advances not proceeding at the expected pace by segmenting their designs, allowing the assembly of various component parts of the processor in stages. Intel has said it’s also moving toward that modular approach.

https://www.bloomberg.com/news/arti...smc-samsung-to-outsource-some-chip-production


Intel suggests it will wait for new CEO to make critical decisions to fix manufacturing crisis

Intel told employees Thursday it may postpone a decision on how to fix its manufacturing crisis, likely waiting for new CEO Pat Gelsinger to join the company next month before deciding whether to outsource advanced manufacturing to rivals in Asia.

The chipmaker committed to investors in October that it would make that decision by the time it announced its fourth-quarter financial results, saying that would leave just enough time to make the switch in time to produce the new chips by its target date in 2023. That announcement is scheduled for next Thursday.

But with Gelsinger’s surprise hiring Wednesday – he starts work on Feb. 15 – the chipmaker wants to give him time to weigh in. That’s according to an account of a Thursday all-hands meeting provided to The Oregonian/OregonLive by Intel employees. The company said it still wants to make the decision “as quickly as possible.”

“We expect to make that decision very soon,” outgoing CEO Bob Swan told employees at the meeting on Thursday, “but we’re going to do it with Pat.”

Intel has suffered a succession of manufacturing failures that derailed three consecutive generations of microprocessor technology, most recently with its forthcoming 7-nanometer chips. The resulting delays cost Intel its historic lead in semiconductor technology, along with precious market share and tens of billions of dollars in market value.

Now, Intel must decide whether to admit technical defeat and outsource its leading-edge chips to rival manufacturers in Asia.

It’s a momentous choice that will have enormous implications for Oregon, home to Intel’s largest and most advanced operations. Intel employs 21,000 Oregonians, more than any other business, and spends billions of dollars every year to equip and maintain its Hillsboro factories.

Intel must make its decision under duress, with competitors encroaching on its turf, marquee customers like Apple choosing to make their own chips instead of using Intel’s, and as investors demand Intel consider selling off its factories.

“We have to deliver better products to the PC ecosystem than any possible thing that a lifestyle company in Cupertino” makes, Gelsinger told employees Thursday. That’s a derisive, if good-natured, reference to Apple and the location of its corporate headquarters.

“We have to be that good, in the future,” Gelsinger added.

Intel declined to comment on Thursday’s employee meeting or its outsourcing plans. It referred to a statement issued Wednesday, in conjunction with Gelsinger’s hiring: “The company has made strong progress on its 7nm process technology and plans on providing an update when it reports its full fourth-quarter and full-year 2020 results as previously scheduled on Jan. 21, 2021.”

Intel has already ceded its historic lead in manufacturing technology to rivals, chiefly Taiwan Semiconductor Manufacturing Co., and any further trouble could render Intel an also-ran for the indefinite future.

In a note to clients after Gelsinger’s hiring, Raymond James analyst Chris Caso said Intel doesn’t have time to deliberate.

“Unfortunately, in order for Intel to implement outsourcing by 2023, decisions need to be made yesterday. Gelsinger’s appointment notwithstanding, we would still view a failure for Intel to discuss a fully developed 2023 outsourcing plan on next week’s call to be a significant negative,” Caso wrote.

“We therefore don’t think Intel has the luxury of waiting until Gelsinger gets into the job to make an outsourcing decision,” Caso wrote. “If the company does wait, they risk falling irreversibly behind.”

An array of problems

Intel lured Gelsinger away from his current job running VMware with a pay package worth more than $100 million. That’s evidently what it took to pull Gelsinger away from a thriving company and attempt to fix Intel’s problems.

Gelsinger, 59, spent the first 30 years of his career at the chipmaker. He was Intel’s first chief technology officer and one of its leading engineers and top Oregon executives when he left in 2009.

Speaking to employees Thursday, Gelsinger insisted that he’s returning to a company that has its best days “in front of it.” But he will be responsible for rebuilding a business that has lost its edge on multiple fronts:
  • Competition: Intel rivals AMD and NVIDIA use TSMC’s factories and have capitalized on the technical advances in Taiwan to leapfrog Intel in key segments. Meanwhile, startups like Ampere – run by former Intel President Renée James – are opening new competitive fronts by developing new chips for the data center.
  • Customers: Apple began shifting away from Intel chips last year for its vaunted Mac line of desktops and laptops in favor of processors Apple engineered itself. While Apple represents a relatively small share of Intel’s revenue, its M1 chips handily outperformed the Intel processors they replaced. That carries the implication other companies might be able to achieve the same thing and may go their own way, too. Microsoft, Amazon and Google are widely reported to be developing chips in-house for PCs or data centers.
  • Culture: Intel’s manufacturing trouble has been accompanied by upheaval in the top ranks and the departure of respected engineers, from Intel veterans to highly touted newcomers.
  • Investors: Intel shed $42 billion in market value on the August day it disclosed its 7nm chips were behind schedule. Under Swan, the outgoing CEO, Intel’s share price barely budged while the broad index of semiconductor stocks doubled.

“From a governance point of view, we cannot fathom how the boards who presided over Intel’s decline could have permitted management to fritter away the Company’s leading market position while simultaneously rewarding them handsomely with extravagant compensation packages; stakeholders will no longer tolerate such apparent abdications of duty,” New York investment firm Third Point wrote in an incendiary note to Intel’s board last month.

Third Point CEO Daniel Loeb called on Intel to consider whether it should sell off its factories altogether, as some analysts have long urged. Separating its research from its manufacturing could make Intel more nimble, ideally leaving it with engineering heft while allowing specialized factories to become a contract manufacturing powerhouse like TSMC.

In his remarks Thursday, Gelsinger said he will continue to integrate Intel’s research and manufacturing.

“When executed well, it has established Intel as a leader in every aspect,” he said. The company’s factories are “the power and the soul of the company,” Gelsinger said, but its business model “does need to be tweaked.”

What Intel has in mind instead, apparently, is some kind of hybrid model in which Intel would outsource only its most advanced chips while allowing time for its struggling factories to catch up and learn how to manufacture the new technology itself.

Its factory setbacks have left Intel choosing from among an array of bad options: whether to outsource its most valuable technology to a rival, to keep manufacturing in-house and hope for better results at its factories, or to dismantle the company.

Low yields

Intel’s latest crisis began in August, when the company shocked investors by announcing it was a year behind in its forthcoming 7-nanometer chip technology. Intel has previously assured shareholders that its latest chips weren’t suffering the kind of setbacks that plagued its prior two generations of 14nm and 10nm processors.

For decades, semiconductor technology has advanced on a microscopic scale as features on computer chips have grown ever tinier – enabling manufactures to pack more transistors into the same space.

That enabled computer makers to improve performance exponentially while simultaneously reducing costs. It’s a virtuous cycle called Moore’s Law, named for Intel co-founder Gordon Moore.

Intel led that cycle for decades, with engineers in its Hillsboro research factories stubbornly defying the laws of physics as the features on their chips approached the atomic scale. Everyone knew that there would be a limit, someday, to just how small these features could get. But people had been predicting the end of Moore’s Law for years and Intel’s scientists had always proved them wrong.

Things began to go south several years ago with Intel’s 14nm chips. Problems recurred with its 10nm technology, which arrived many years behind schedule, and once again with the forthcoming 7nm processors. In each case the company suffered low “yields,” meaning that many of the chips that came off its production line had defects that rendered them useless.

Defects are inevitable when operating on scales so small that even a microscopic speck of dust will ruin an entire chip. In normal times, Intel would simply toss the bad ones out and sell the rest. Over time, the company would perfect the manufacturing process and reduce the number of defective chips and improve its profitability.

If there are too many defects, though, Intel has to discard too many chips to make a profit on the rest. For its most recent chips it’s taken Intel several years to get the process right.

Intel blamed delays on its current generation of 10nm chips on being too ambitious in adding new features. It promised a more manageable approach with the 7nm generation but hasn’t explained why development of those processors went haywire, too.

Whatever problems Intel is encountering, though, its rivals don’t seem to be running into the same roadblocks. TSMC has steadily moved ahead with each new generation of chip technology.

Pressing its advantage, TSMC said Thursday it will spend up to $28 billion to expand its production capacity --an astonishing 60% increase. Even if Intel can fix its factories, it may not be able to match what TSMC is investing in its own future.

‘A proven leader’

The cupboard isn’t bare, though. Intel indicated Wednesday that its 2020 sales will top $75 billion, up nearly 5% from last year and well ahead of its forecasts at the beginning of that year. PC demand was strong as more people work from home during the pandemic and the data center industry remains robust overall.

Intel introduced a slate of new processors for PCs this past week, new chips that it claims provide significant upgrades in performance and power efficiency.

And inside Intel’s Oregon factories, technicians report the company is busily installing new manufacturing tools. It’s not apparent to them that Intel is hedging its bets or preparing for a major upheaval.

There’s no chance that Intel will walk away from its Oregon investments, or make significant cuts anytime soon. The company is two years into construction on a multibillion-dollar expansion of its D1X research factory at its Ronler Acres campus near Hillsboro stadium.

To make investments on that scale pay off, Intel needs to keep those factories humming. But if Intel decouples its research from its leading-edge manufacturing it will inevitably diminish Oregon’s essential role within the company, which could lead to a long-term decline at its Washington County campuses.

Intel’s Thursday deadline for an outsourcing decision was self-imposed but not arbitrary. Sending that work to offshore contractors will require years of work to coordinate the transition and reserve manufacturing space. Intel indicated this past week that it needs the new chips on hand in 2023, whether it makes them itself or buys them from a foundry like TSMC or Samsung.

Investment analysts are split over whether Intel should keep making its own processors or send advanced manufacturing to Asia. But there is broad agreement that Gelsinger brings engineering and leadership skills to Intel that Swan, a finance professional, simply didn’t offer.

“Bob Swan, while a solid manager, was not the right person to lead a manufacturing turnaround at the company,” Susquehanna Financial Group analyst Christopher Rolland wrote in a note to clients Wednesday. “We applaud the board’s decision to bring back Gelsinger, a proven leader with real experience in chip architectures and manufacturing, to push the company in a new direction.”

https://www.oregonlive.com/silicon-...itical-decisions-on-manufacturing-crisis.html

Pessoalmente, acho que a Intel irá ter que fazer outsource de pelo menos parte do fabrico dos seus Processadores High End e pelo menos durante algumas gerações. Nem coloco de lado, mais à frente, a Intel vender a parte das Fábricas, mas aí, será sempre uma venda muito complicada. O mesmo problema que a AMD teve, mas numa dimensão muito maior.
Seja como for, a decisão terá que ser feita (se já não foi), nos próximos tempos e eles devem falar disso a apresentação de resultados, que afinal, parece que é dia 21 de Janeiro.
 
Acho que a Intel tem potencial para comprar a maior parte dos 7nm da TSMC para dar um boost de IPC e acho que era um "Intel is here 7nm best ever" e levantar a cabeça :002:

E se jogarem bem encostavam a AMD ao bolso again
 
Quando a Intel passou o que passou para ter os 10 nm afinados ir para os 7nm TSMC nao faz sentido pk a densidade de transistores vai ser similar.

Agora como o Intel ja esta a ter grandes dificuldade nos 7nm provavelmente o novo CEO ja esta a ver o msm filme dos 10nm e dai quererem ir logo para os 5nm TSMC que ja devem ser quase similares em densidade aos 7nm da intel.

A intel que normalmente tinha a boa "mania de ser pioneira" podiam era fazer outsourcing dos CPU's sim ,e assim focavam-se era no futuro em termos CPU's em graphene .

https://www.extremetech.com/computi...finally-punch-the-gas-pedal-drive-faster-cpus

https://www.popularmechanics.com/technology/a23353/1nm-transistor-gate/
 
Última edição:
Acho que a Intel tem potencial para comprar a maior parte dos 7nm da TSMC para dar um boost de IPC e acho que era um "Intel is here 7nm best ever" e levantar a cabeça :002:

E se jogarem bem encostavam a AMD ao bolso again

Não, não tem.
Nem todo o dinheiro da Intel junto tem potencial para isso.

A TSMC tem contratos a cumprir e produção atribuída aos seus vários clientes.
E a própria TSMC não só tem interesse em priveligiar os seus clientes mais antigos, como não tem interesse nenhum em priveligiar como cliente a sua maior concorrente em produção de wafers em detrimento dos clientes tradicionais que não têm fabs próprias, ficando o seu revenue fortemente dependente da única empresa que lhe pode fazer concorrência.

A Intel tem muito dinheiro, pode contratar bastante produção à TSMC, eventualmente pagar construção de fabs da TSMC para isso.
Mas não tem hipóteses de fazer isso assim de um momento para o outro, a produção é contratada bastante tempo antes, e nem será em detrimento dos outros clientes da TSMC.

Pessoalmente, acho que a Intel irá ter que fazer outsource de pelo menos parte do fabrico dos seus Processadores High End e pelo menos durante algumas gerações. Nem coloco de lado, mais à frente, a Intel vender a parte das Fábricas, mas aí, será sempre uma venda muito complicada. O mesmo problema que a AMD teve, mas numa dimensão muito maior.
Seja como for, a decisão terá que ser feita (se já não foi), nos próximos tempos e eles devem falar disso a apresentação de resultados, que afinal, parece que é dia 21 de Janeiro.
Outsourcing vão ter que fazer de certeza.

Mas a venda das fabs é questão demasiado complicada porque envolve política.
O governo dos EUA não vai querer ficar sem fabs nacionais de processo avançado e não vai deixar empresa estrangeira liderar as fabs americanas, se forem as únicas.
 
Quem tem dinheiro para fazer isso (e fez com os 5 mm) é a Apple.
A Apple já faz isso à algumas gerações, e se a TSMC tem o avanço que tem em processo de fabrico é, também, graças a esse investimento da Apple e ao sucesso dos produtos da marca da maçã.

Mas a Intel, mesmo que tivesse mais dinheiro do que a Apple, não conseguiria no imediato ter acesso assim á produção da TSMC.

A Intel poderá investir bastante na TSMC, mas demorará o seu tempo e também não é do interesse da TSMC priveligiar a Intel face aos seus melhores clientes fabless.

Já a AMD tem aumentado e muito as vendas. Está muito longe da Intel, mas ainda assim já vai ter capacidade para reservar bastante mais capacidade de produção para zen 4 e zen 5.
 
Exactamente.
Tentei explicar isso antes, existem muitos factores que impedem que a coisa se processe assim. Não é só decidir comprar chips à TSMC e compram, a capacidade da TSMC está esgotada.

A TSMC não tem interesse nenhum em deixar na mão clientes de anos e anos que não terão fabs no futuro próximo e com quem tem contractos.
Para tal seriam precisos muitos anos de investimento da Intel na TSMC ao mesmo tempo que teria de investir nas fabs próprias.

Não digo que não produza uma ou outra coisa externamente mas nunca em volume significativo. Teriam de alterar o modelo de negócio o que é um pesadelo, demora tempo e dinheiro para além de acarretar muitos riscos.
 
Última edição:
A TSMC vai ter brevemente uma fabrica nova a abrir e vai ter mais capacidade para 5nm/3nm supostamente, era para 2022 mas asecalhar ainda vai ser no final deste ano.
 
A AMD, Qualcomm, Apple e tantos outros já estão na calha para absorver esses chips, tendo negociado há bastante mais tempo.


Não se dimensionam fabs com capacidade substancialmente acima do que já têm assegurado. Os custos são astronómicos.
Certamente que a grande maioria da capacidade da produção dos futuros 5 e 3 nm já tem destino.
 
Última edição:
Uma tradução de um report da Digitimes, em mandarim:
E1SAqUI.jpg


GWPLka4.png


https://twitter.com/chiakokhua/status/1354736204898578435
https://twitter.com/chiakokhua/status/1354736213744361472

Nada disto é oficial, mas fica aqui o resumo:
  • A Intel continua, oficialmente, a ser muito vaga sobre os acordos de produção com terceiros.
  • A Intel terá chegado a acordo com a TSMC, em 2020, para a produção de produtos a 3 nm, que deverá começar a ser produzido em massa no segundo semestre de 2022.
  • Este acordo estende-se até aos 2 nm.
  • A Intel passará a ser o 2º maior cliente da TSMC, a seguir à Apple.
  • Se nada se alterar, e ao contrário de acordos anteriores, a produção irá incluir produtos novos e "Core" da Intel.
  • A estratégia, alegadamente, passará por produzir estes produtos simultaneamente na TSMC e nas fábricas da Intel.
  • No entanto, a maior parte da produção passará pela TSMC.
  • Engenheiros da Intel têm visitado o centro de R&D da TSMC nos últimos 2 anos.
  • A Intel continuará a investir R&D nas suas fábricas.
  • A TSMC e a Apple estarão em cooperação para o desenvolvimento inicial de 2 nm.
  • A TSMC já terá garantidas ordens nos 3 nm, da Apple, Intel, AMD, Mediatek, etc.
  • A TSMC terá feito encomendas de máquinas EUV à ASML em quantidades semelhantes à Intel e Samsung juntas.
  • A AMD terá que atingir um market share de 20% a nível de Servidores e Notebooks, nos próximos 2 anos, para conseguir manter o seu estatuto perante a TSMC.
 
Se isto for mesmo assim para mim é uma surpresa.
No meu ponto de vista esta estratégia não faz muito sentido para a TSMC pelas razões que enumerei em posts anteriores. Para isto ser minimamente real a Intel deve ter despejado rios de dinheiro na TSMC!
 
Já para nem mencionar o mais óbvio: indirectamente a Intel deixa de ser a "líder" no processo e a reclamar e o estatuto "o meu é melhor que o teu".

Posto isto como justificar o custo, à partida cada vez maior e R&D?

Em relação à AMD, a acreditar na mesma fonte, e num post posterior da mesma conta do Twitter mencionada, o problema nem está directamente relacionado com a TSMC, mas com as empresas OSAT, algo que também já tinha mencionado algures.
 
  • A AMD terá que atingir um market share de 20% a nível de Servidores e Notebooks, nos próximos 2 anos, para conseguir manter o seu estatuto perante a TSMC.

Se dessem vazão ao que eles precisam e AMD inundasse o mercado de APUs e afins e ser agressiva no preço, era canja.
 
A não ser que o problema não esteja na produção dos "dies".
O Digitmes já tem reportado a hipótese de serem os OSAT a estar com constrangimentos na capacidade, devido ao aumento de pedidos de todo o lado.

Publicado, e replicado no início do mês (a fonte é a digitimes)
Report: AMD Chip Shortage Caused by Packaging Issues, PlayStation 5
https://www.tomshardware.com/news/amd-chip-shortage-packaging-issues

e no mesmo dia do post do Nemesis11, o mesmo "Retired Engineer" a.k.a. chiakokhua, postou isto

DigiTimes: "AMD says main reason for shortages is due to backend package and test capacity constraints, as well as ABF substrates yields"
https://twitter.com/chiakokhua/status/1354965916962979847

Isto é dinâmico e está interligado, ao aumento de capacidade da produção das foundries (que cada vez mais está dependente de maquinaria UV que também tem as suas limitações na produção), tem de corresponder o necessário aumento da produção das wafers de silício (a matéria prima das foundries), e a capacidade de processar essas mesmas wafers após a sua "impressão", e tudo isto demora o seu tempo, num mercado que está em expansão e completamente saturado, seja qual for a foundry, o processo e o segmento de mercado.

Basicamente há falta de tudo e os preço têm estado a disparar.
 
Back
Topo