Asetek signs research agreement with Prof. Massoud Kaviany (two phase cooling)

N3RO

Power Member
Broenderslev, Denmark, June 21 2007 – Asetek, the market leader of thermal management solutions for semiconductors, announced today that they have signed a research agreement with Professor, Ph.D. Massoud Kaviany from University of Michigan.

CPU and GPU capabilities improve by continuously growing the number of transistors in the core, by increasing the clock frequency, and by implementing more CPU cores into multicore processors. This results in higher power consumption which makes thermal management much more challenging. However, there is another factor which is becoming more critical than power consumption; hotspots. Hotspots can generate a very high heatflux and therefore impose tremendous demands on the effectiveness of the CPU and GPU cooler.

To meet this challenge Asetek will work in cooperation with Professor Massoud Kaviany to develop advanced single and two phase cooling solutions. These solutions will have the ability to handle the highly localized and extreme heatfluxes in the future CPU and GPU systems.

“It is an exciting time at Asetek, and we are really pleased to have partnered with Professor Massoud Kaviany on the development of these new cooling solutions,” says Christian Christiansen, VP of Engineering at Asetek. Christian Terp, Thermodynamics Specialist at Asetek, goes on to say, “Professor Kaviany’s knowledge and expertise in two phase cooling and porous media technologies is extremely impressive and we are looking forward to the product innovation that will come from his contributions.”

“I have worked with the Asetek staff at the headquarters in Denmark and feel they are a well-staffed and focused firm with the goal of producing innovative and cost-effective e-cooling devices,” says Professor Massoud Kaviany. “The concept-prototype-production stream is logical and very forward looking with an international perspective. I find Asetek open to new materials and methods for the next generation heat dissipation devices and anticipate a productive relationship resulting in innovative technologies which Asetek can bring to market.”


(PR from Asetek)
 
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